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1.原文連結：連結過長者請使用短網址。
https://www.phonearena.com/news/qualcomm-dual-sourcing_id147225


2.原文標題：標題須完整寫出且須符合內文(否則依板規刪除並水桶)。
Qualcomm might split 3nm Snapdragon 8 Gen 4 production between TSMC and
Samsung

高通可能把8 gen 4同時給台積和三星生產

3.原文來源(媒體/作者)：例:蘋果日報/王大明(若無署名作者則不須)
phone arena/ Alan Friedman


4.原文內容：請刊登完整全文(否則依板規刪除並水桶)。

Qualcomm's current high-end chipset, the Snapdragon 8 Gen 2, is manufactured
by TSMC using its 4nm process node. In the past. Qualcomm has had its
flagship application processor built in some years by TSMC and by Samsung
Foundry in other years. For example, the Snapdragon 855 and 865 were built by
TSMC using its 7nm and enhanced 7nm nodes respectively. The Snapdragon 888
SoC and the Snapdragon 8 Gen 1 were produced by Samsung Foundry.


Snapdragon 888 SoC 和 Snapdragon 8 Gen 1 由 Samsung Foundry 生產。

But last year Qualcomm, seeking to increase the performance of the Snapdragon
8+ Gen 1, turned production of the 4nm chip over to TSMC. This also occurred
at the same time it was discovered that Samsung Foundry's yields on its 4nm
production was a paltry 35%. This means that at the time, 65% of the die
produced on a 300mm wafer did not pass quality control. As a result, Qualcomm
decided to turn manufacturing of the Snapdragon 8+ Gen 1 AP over to TSMC.

但去年高通為了提高第一代驍龍 8+ 的性能，將 4nm 芯片的生產交給了台積電。這也發
生在同時發現三星代工廠的 4nm 生產良率只有微不足道的 35%。這意味著當時在 300mm
晶圓上生產的芯片中有 65% 沒有通過品質控制。因此，高通決定將 Snapdragon 8+ Gen
1 AP 的製造工作移交給台積電。

Samsung has reportedly doubled its 4nm yield from 35% to 70% nearly matching
TSMC

據報導，三星已將其 4nm 良率從 35% 提高了一倍至 70%，幾乎與台積電相當

Even though Samsung has reportedly improved its 4nm yield to 70%, the
Snapdragon 8 Gen 2 chipsets (including the "for Galaxy" variant) are built by
TSMC. According to tipster Revegnus (via Wccftech), Qualcomm is considering a
dual-sourcing strategy for future high-end chipsets. This plan would start
with the Snapdragon 8 Gen 4 for 2025 with TSMC building the regular version
of the SoC using its enhanced N3E 3nm process node. The Snapdragon 8 Gen 4
for Galaxy, earmarked for the flagship Galaxy S25 line, would be made by
Samsung Foundry using its 3nm process node.

儘管據報導三星已將其 4nm 良率提高到 70%，但驍龍 8 Gen 2 芯片組（包括“for


Last year, it appeared that Samsung would be producing the overclocked
Samsung Galaxy 8 Gen 2 for Galaxy SoC but this plan, similar to what Revegnus
says could be in the works for 2025, did not happen. As we already pointed
out, TSMC is the foundry making both Snapdragon 8 Gen 2 variants. But things
do get a bit dicier at 3nm as TSMC continues to use its FinFET transistors
for 3nm while Samsung uses Gate All Around (GAA) for its 3nm production.
The Snapdragon 8 Gen 4 for Galaxy chip could outperform the regular version
thanks to GAA



The Snapdragon 8 Gen 4 for Galaxy chip could outperform the regular version
thanks to GAA

由於GAA，用於Galaxy芯片的Snapdragon 8 Gen 4可以勝過普通版本

Since GAA surrounds the channel on all four sides, it reduces current leaks,
increases the drive current, offers more precise control over current flow
and chips using GAA typically have faster performance consuming less energy.
TSMC plans on moving to GAA from FinFET with its 2nm process node. The bottom
line is that the Snapdragon 8 Gen 4 for Galaxy chipsets, if made by Samsung
Foundry, could outperform the regular version of the chip made by TSMC for
reasons other than overclocking the high-performance core.



Using both TSMC and Samsung Foundry to make both variants of the Snapdragon 8
Gen 4 would be a cost-cutting move for Qualcomm. The upcoming Snapdragon 8
Gen 3 will be made by TSMC using its N4P process node. Only Apple among major
phone manufacturers seems willing to spend the $20,000 per wafer price for
3nm production this year which is why the iPhone 15 Pro and iPhone 15 Ultra
could be the only handsets powered by 3nm silicon later this year.



But next year could see a decline in wafer prices for 3nm production which
would allow Qualcomm to use the cutting-edge node for both Qualcomm 8 Gen 4
versions regardless if they are coming from TSMC or Samsung Foundry or both.

但明年 3nm 生產的晶圓價格可能會下降，這將使高通能夠將尖端節點用於兩個高通 8
Gen 4 版本，無論它們來自台積電還是三星代工或兩者。

A recent report says that TSMC will be ready to mass produce 2nm chips by
2025. The same year, Samsung Foundry is also supposed to start production of
2nm silicon in 2025 moving to 1.4nm by 2027. Since transistor counts continue
to move up with every new process node, the main issue is making transistors
small enough so that more of them can fit inside chips. There are 16 billion
chips inside the Snapdragon 8 Gen 2 versus 10.3 billion in the Snapdragon 888
introduced in late 2020 and used on phone in 2021.


Snapdragon 8 Gen 2 中有 160 億個芯片，而 2020 年底推出並於 2021 年用於手機的
Snapdragon 888 中有 103 億個芯片。

5.心得/評論：內容須超過繁體中文30字(不含標點符號)。
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看來三星很有可能用自己生產的gen 4
理論上三星的GAA能耗比它們自己的4LPP少了50%
的確是非常大的提升
但是否能夠因此超過競爭對手就不太確定了
反正就算三星版的翻船對高通來說也沒差就是了

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※ 發信站: 批踢踢實業坊(ptt.cc), 來自: 111.249.88.42 (臺灣)
※ 作者: kyle5241 2023-05-01 22:16:08
※ 文章代碼(AID): #1aJyckZJ (MobileComm)
※ 文章網址: https://www.ptt.cc/bbs/MobileComm/M.1682950574.A.8D3.html